Chippacking Technology Co., Ltd. (hereinafter referred to as “Company” or “Qipai Technology”) was established in November 2006 by Liang Dazhong and Bailuo couples in Longgang District, Shenzhen with a registered capital of 79.7 million yuan, mainly in the research and development of integrated circuit packaging and testing technology. Based on application, it is engaged in integrated circuit packaging, testing and packaging technology solutions. The main packaging forms are DIP, SOP, SOT, TO, LQFP, QFN/DFN, BGA, etc. and Qipai series and CPC series package independently invented by Qipai Technology. form. Qipai Technology is a national high-tech enterprise, a high-tech enterprise in Shenzhen, and an IC packaging and testing high-tech enterprise encouraged by the state.